The hydrogen bond (H-bond) is a ubiquitous, key element of many natural and synthetic materials including proteins, hydrogels, organic electronics, and peptide-based biomaterials. Weaker than covalent bonds and stronger than the van der Waals attraction, H-bonds play a critical role in mechanical, thermal, and electrochemical processes of H-bonded materials. This talk will focus on two H-bonded materials in which exceptional thermal properties are highly desired. The first is the beta-sheet and helical molecular structures that are the most fundamental building blocks of proteins in living systems. The second is the interfaces between organic and inorganic materials that have critical impact on the thermal management and energy efficiency of lithium-ion batteries. This talk will provide an overview of our recent research on these topics. Fundamentally, phonon dynamics and energy transfer analysis jointly provide insightful pictures of how H-bonds facilitate thermal transport processes at the nanoscale. Based on the achieved fundamental understanding, several innovative molecular designs are proposed and analyzed by a rational approach, with the goal to guide genetic, peptide and interface engineering in creating new materials for potential biomedical and energy applications.
Dr. Ling Liu is an Associate Professor in the Department of Mechanical Engineering at Temple University. He received PhD from Columbia University, and BS and MS from Dalian University of Technology in China. His current research focuses on the multiscale modeling, simulation and design of advanced materials for improved physical understanding and accelerated design. Examples include 3D printed materials, nanostructured materials, nanomaterials and biomaterials with extraordinary thermal properties, and multiphysics and safety of nuclear materials and composite materials in extreme environments. His research has been sponsored by NSF, DOE, DOD and industry, leading to over 50 peer-refereed journal publications. He was the chair for the ASME Multifunctional Materials technical committee and the Materials for Medicine and Biology technical committee. He received the NSF CAREER award in 2018.
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