ProfessorELab 301A 301A ELab University of Massachusetts 160 Governors Drive Amherst, MA 01003-2210 firstname.lastname@example.org(413) 545-2005(413) 577-2365Injection Molding Optimization LabHorizontal TabsEducation B.S., University of California at Berkeley, 1978; M.S., Massachusetts Institute of Technology, 1980; Ph.D., Massachusetts Institute of Technology, 1983 Research Manufacturing of polymeric materials; flow simulation capability of multi-component injection molding processes Program Area: Mechanical EngineeringResearch Area: Biomedical & Healthcare EngineeringAdvanced Design & Manufacturing Publications Mingwen Hu, Chiung-Fang Hsu, Byung Kim “The Intrinsic dynamics of Cse1p and Xpot elucidated by coarse-grained models,” Computational Biology and Chemistry, Vol. 48, 45-54, 2014 Ramasubramani Kuduva Raman Thanumoorthy, Byung H. Kim, Donggang Yao, “Constant-Temperature Embossing of Supercooled Polymer Films,” Polymer Engineering and Science, 54 (5), 1100-1112, 2014. Raymond Frenkel, Byung Kim *, Donggang Yao, “Extrusion Roller Imprinting with a Variotherm Belt Mold,” Machines,2, 299-311, 2014. Sung-Hoon Park, Eun-Hyoung Cho1, Jinseung Sohn, Paul Theilmann, Kunmo Chu, Sunghee Lee, Yoonchul Sohn, Dongouk Kim, and Byunghoon Kim, “Design of multi-functional dual hole patterned carbon nanotube composites with superhydrophobicity and durability,” Nano Research, 6(6): 389,398, 2013. Mingwen Hu, Brian O'Riordan, Byung Kim and Moon Ki Kim, “Comparison of all-atom and coarse-grained normal mode analysis in the elastic network model,” Journal of Mechanical Science and Technology, 27 (11) 3267-3275, 2013 Mingwen Hu and Byung Kim, "Flexibility of the Exportins Cse1p and Xpot Depicted by Elastic Network Model," Journal of Molecular Modeling. Vol.17,1735-1741, 2011. Kuen Park and Byung Kim, "Application of rapid heating of injection mold using high frequency induction heating" Korean Journal of Machinery, Vol.51, No.4 pp 50-54, 2011. Mingwen Hu and Byung Kim, "Flexibility of the Exportins Cse1p and Xpot Depicted by Elastic Network Model," Journal of Molecular Modeling. DOI: 10.1007/s00894-010-0875-5 Nov. (2010) Matthew Fagan, Byung Kim, and Donggang Yao, "A Novel Process for Continuous Thermal Embossing of Large-Area Nanopatterns onto Polymer Films," Advances in Polymer Technology, Vol. 28, No, 4, 246-256, 2009 Thomas E. Kimerling, Donggang Yao, and Byung H. Kim, “Injection Molding Poly(paraphenylene) with a rapidly heated mold ” Polymer/Plastics Technology Engineering, Vol. 48, No. 10-12, 1008-1013, 2009 O. Nezuka, D. Yao, and B. H. Kim, “Replication of Microstructures by Roll-To-Roll UV-curing Embossing, Polymer/Plastics Technology Engineering, 47: 865-873 (2008) S. Kim, C-S Shiau, D. Yao, B.H. Kim, “Injection Molding Nanoscale Features with the Aid of Induction Heating, ”Polymer/Plastics Technology Engineering, 46: 1031-1037, 2007.